Find Engineering team leader Jobs in Bandon, C

RFIC Packaging (Mechanical) Engineer
M/A Com Technolgy Solutions —Cork, County Cork
- AutoCAD
- Engineering
- English
11d
Senior Engineer, Embedded Software
Analog Devices —Cork, County Cork
- Full-time
- Computer Science
- Master's degree
- C++
Staff Technical Program Manager, Site Reliability Engineering
MongoDB —Cork, County Cork
- Remote
- Azure
- AWS
- SDLC
Senior Planning/Scheduler Manager - Energy and Infrastructure Sector
Mace —Cork, County Cork
- Full-time
- Hybrid work
- Microsoft Excel
- Engineering
- Microsoft Office
Equipment Technician
Alcon —Cork, County Cork
- Full-time
- Engineering
10d
Product Manager (12-month FTC)
Vusion —Cork, County Cork
- Full-time
- Remote
- Continuous improvement
- Product management
- Communication skills
Quick apply
Principal Engineer
Sweco UK —Cork, County Cork
- Hybrid work
- AutoCAD
- CAD
- Recruiting
- Employee assistance program
- Employee discount
Contracts/Senior Contracts Manager
Sisk —Cork, County Cork
- Full-time
- Contracts
- In-person
- Communication skills
- Annual leave
Embedded Hardware Engineer
Collins Aerospace —Cork, County Cork
- Full-time
- Doctoral degree
- Master's degree
- C++
3d
Associate Director, Commercial Supply Chain Governance & Reporting
Gilead Sciences —Cork, County Cork
- Full-time
- Doctoral degree
- Engineering
- Master's degree
Senior NPI Test Engineer
M/A Com Technolgy Solutions —Cork, County Cork
- Master's degree
- Bachelor's degree
- No degree
11d
Lead AI Developer
OpenText —Cork, County Cork
- On call
- Azure
- Computer Science
- Master's degree
12d
Lead Site Reliability Engineer
Tricentis —Cork, County Cork
- Full-time
- Azure
- DevOps
- AWS
5d
Engineer, Snr Electronic Design
Moog Inc. —Carrigaline, County Cork
- Full-time
- Management
- Analysis skills
- In-person
MES Engineer Tulip
Cognizant —Cork, County Cork
- Full-time
- Hybrid work
- Oracle
- System design
- No degree
10d
Associate Director - Mechanical
EDC Engineering Design Consultants LTD. —Cork, County Cork
- Overtime
- Hybrid work
- Master's degree
- Team management
- Leadership
- Annual leave
- Work from home
Quick apply
11d
Senior Engineer
Tetra Tech —Ballincollig, County Cork
- Hybrid work
- Master's degree
- Contracts
- Communication skills
PWS Sales Manager - Data Centre Solutions
Emerson —Cork, County Cork
- Full-time
- Sales
- Employee assistance program
12d
Senior Product Manager, Interoperability
Datavant Ireland —Cork, County Cork
- Remote
- Project management
- Product management
Quick apply
11d
Principal AI Developer
OpenText —Cork, County Cork
- Computer Science
- System design
- Master's degree
12d

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RFIC Packaging (Mechanical) Engineer

M/A Com Technolgy Solutions -
Cork, County Cork

Apply Now

Job details

11 days ago

Qualifications

AutoCAD
Fabrication
Engineering
English
Microsoft Office
Master's degree
Minitab
Assembly
Bachelor's degree
SolidWorks
Telecommunication
Communication skills

Full job description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Job Purpose
Project Manager and Technical lead for MMIC (GaAs, GaN, Si, SOI) package development and volume production manufacturing, supporting new product introductions from concept through production release. This individual will provide direction to product and design engineers for optimum, cost-effective packaging solutions including thermal and mechanical design/analysis. Package types include overmolded, leadframe-based packages, laminate packages, ceramic packages and metal packages for RF and Microwave assemblies. This individual may be required to manage/lead multiple new product packaging development programs in parallel to delivering packaging solutions on schedule for high volume, high mix manufacturing.

Main Duties and Responsibilities

Major Project Technical lead for developing RF and Microwave packaging solutions.
Work with internal Product Design, QA, Reliability, Supply chain and external suppliers to develop, apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality.
Work with Design Engineering, Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
Work with vendors and internal engineering resources to establish and update design rules for packaging.
Team-lead in performing packaging design reviews to ensure adherence to Design-for-Manufacture guidelines.
Contribute to establishing and implementing robust assembly processes internally and at contract manufacturers.
Provide supplier benchmarking and tracking data to drive backend technology roadmaps.
Working with Quality organization, characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects, then define and implement corrective actions.
Team-lead in Design/Development of tooling for high volume, high mix processes.
Team-lead in establishing application notes for new packages.

Key Competencies Required

MS +6 or BS +8 years of experience in Materials Science, EE or ME with advanced IC package process development and design with emphasis on RF and Microwave assemblies.
Comprehensive knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, molding, etc.)
Proven track record of successfully driving package design/development/characterization activities from concept to implementation. Strong understanding of relationship between materials and package performance.
Demonstrated ability to lead independent process development efforts and provide suppliers direction by working with design, assembly, and quality organizations
Experience in working with high volume and mixed volume manufacturing operations around the globe.
Comprehensive knowledge of product characterization, testing, quality and reliability, including compliance testing and certification [JEDEC, IPC, EIA, RoHS, WEEE, Mil-Standards]
Experience in process troubleshooting, failure analysis and Six Sigma methodologies (Process mapping, C&E, PFMEA, DOE, SPC)
Ability to lead projects under tight deadlines, with strong ownership of projects
Ability to work effectively in a multi-project mode
Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and business group review meetings
Good teamwork skills in working together to achieve goals
Experience with AutoCAD and/or Solidworks is required
Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) is a plus
Experience using Minitab or Jump is a plus
Fluent with Microsoft Office products.
International travel required
Fluency in spoken and written English

Apply Now

Refine Your Search

engineering team leader jobs in bandon, c

RFIC Packaging (Mechanical) Engineer

Senior Engineer, Embedded Software

Staff Technical Program Manager, Site Reliability Engineering

Senior Planning/Scheduler Manager - Energy and Infrastructure Sector

Equipment Technician

Product Manager (12-month FTC)

Principal Engineer

Contracts/Senior Contracts Manager

Embedded Hardware Engineer

Associate Director, Commercial Supply Chain Governance & Reporting

Senior NPI Test Engineer

Lead AI Developer

Lead Site Reliability Engineer

Engineer, Snr Electronic Design

MES Engineer Tulip

Associate Director - Mechanical

Senior Engineer

PWS Sales Manager - Data Centre Solutions

Senior Product Manager, Interoperability

Principal AI Developer

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