Customer Integration engineers' responsibilities include (but not limited to):
Critical Responsibility will be for identifying recurring patterns and learnings from customer engagements, abstracting these into foundry standards, systemising, automating and proliferating them across other technologies and customers.
Be the DRI (Directly Responsible Individual) to support customer improvement projects and respond to process issues on behalf of the customer.
Will be responsible for regular communication with the customer and from the customer to the factory.
Be the single point of contact for FEOL or BEOL process integration issues for customer.
Collaborate with Technology Development team to import new technology to Customer Products.
Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
Own engineering projects to improve product yield, quality, performance and to reduce wafer cost.
Candidate should possess the following behavioural skills:
Problem-solving technique with strong self-initiative and self-learning capabilities.
Comfortable working with a high degree of autonomy
Ability to work with multi-functional, multi-cultural teams.
Must be highly organised with the ability to identify patterns from customer-specific issues, abstract key learnings, and systemise and proliferate best practices across teams and technologies.
Must demonstrate excellent communications skills and the ability to distil complex information in to easily understandable messages.
Must possess a high degree of ownership for problems with a high tolerance for ambiguity.
Minimum Qualifications:
Bachelor's degree in science and engineering major.
15+ years' experience in advanced node semiconductor industry in FEOL Process Integration.
15+ years' experience in advanced node semiconductor development or high-volume manufacturing.
Preferred Qualifications:
Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major is preferred.
Other related science and engineering degrees can be considered based on industry experience.
Experience in project/program management and advanced problem solving.
Demonstrated interpersonal skills including influencing, engaging, and motivating.
Experience in new semiconductor technology development.
Solid understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.
Experienced Hire
Shift 1 (Ireland)
Ireland, Leixlip
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
